Download Call For Papers: Topical Meeting on Electromagnetic Compatibility of Integrated Circuits and Systems-on-Chip

The Topical Meeting on the Design of 2D & 3D Integrated Circuits and Systems for Electromagnetic Compatibility will be held in conjunction with 2012 Asia-Pacific International EMC Symposium (APEMC2012) in Singapore, from May 22 to 24, 2012.  Presented papers are also published in the IEEE Xplore Digital Library.  Topics of interest include, but are not limited to:

	Design of 2D and 3D Systems-on-Chip (SoC) for EMC
	Hardware-software co-design and integration for IC EMC
	Emission and immunity-aware IC desgin
	ESD immunity techniques at IC level
	Signal and power integrities at IC level
	Combined effects of radiation and aging on IC EM sensitivity
	Harsh environment effects on IC EM sensitivity
	IC EMC for avionics and automotive real-time applications
	EMC-robust analog and mixed signal circuits
	RF ICs for EMC
	IC EMC measurement techniques
	IC EMC modelling techniques
	EMC-robust embedded software
	IC simulation tools and procedures for EMC
	IC standards and regulations for EMC

 
 
Important Dates   

Preliminary paper submissions (2 pages in PDF format only)	- January 6, 2012
Notification of acceptance	- February 5, 2012
Final paper submission (maximum 4 pages)	- March 15, 2012

All submissions must be electronic and submit via the APEMC2012 Submission Portal.  Font embedding must be IEEE Xplore compatible.  No hardcopies shall be accepted.


Topical Meeting Organising Chairs

Sonia BEN DHIA, LAAS CNRS, France email: sonia.bendhia@insa-toulouse.fr

Fabian VARGAS, PUCRS, Brazil email: vargas@computer.org

   
Scientific Committee

A. BARIĆ, FER, Croatia P. BESSE, Freescale, France A. BOYER, LAAS CNRS, France M. COENEN, EMC MCC bv, Netherland C. DUEÑAS, Freescale, Brazil B. DEUTSCHMANN, Infineon, Germany F. FIORI, Polito, Italy

E. GATTI, INTI, Argentina F. HERNANDEZ, Univ. ORT, Uruguay R. MALTIONE, Freescale, Brazil C. MAROT, EADS, France M. RAMDANI, ESEO, France L. PÖHLS, PUCRS, Brazil

F. SILVA, UPC, Spain T. STEINECKE, Infineon, Germany B. VRIGNON, Freescale, France O. WADA, Kyoto Univ. Japan X. C.  WEI, Zhejiang Univ., China S. YUAN, FCU, Taiwan