ASIA-PACIFIC EMC WEEK
2008 Asia-Pacific Symposium on Electromagnetic Compatibility
in conjunction with the
19
th Intern. Zurich Symposium on Electromagnetic Compatibility
May 19 - 22, 2008  Singapore
 

Symposium Committee

 

Symposium Steering Committee

General Co-Chairs   Ruediger Vahdieck
  ETH, Zurich, Switzerland
  vah@emcz.ethz.ch

  Raj Thampuran
  A-STAR IHPC, Singapore
 
Technical Program Co-Chairs   Flavio Canavero
  Politecnico di Torino, Italy
  flavio.canavero@polito.it

  Osamu Fujiwara
  Nagoya Institute of Technology, Japan
  fujiwara@odin.elcom.nitech.ac.jp

  Zhongxiang Shen
  Nanyang Technological University, Singapore
  ezxshen@ntu.edu.sg
 
Organizing Committee   Er-Ping Li, Symposium Chair
  A-STAR IHPC, Singapore
  erpingli@ieee.org

  Kye-Yak See, Chair
  Nanyang Technological University, Singapore

  Ban-Leong Ooi, Co-Chair
  National University of Singapore, Singapore

  Dirk Baumman
  A-STAR IHPC, Singapore

  Eng-Kee Chua
  A-STAR IHPC, Singapore

  Jun-Hong Deng
  TUV-SUD-PSB, Singapore

  Klaus Krohne
  A-STAR IHPC, Singapore

  Hooi-Been Lim
  A-STAR IHPC, Singapore

  En-Xiao Liu
  A-STAR IHPC, Singapore

  Chao-Fu Wang
  National University of Singapore, Singapore

  Kok-Hwee Lim
  Teseq Pte Ltd, Singapore

  Oliver Tong
  DSO National Laboratories, Singapore
 

    Franz Schlagenhaufer
  West Australia University, Australia

  YanHong Wen
  Beijing Jiaotong University, China

  Peter Leung
  City University of Hong Kong, China

  Ryuji Koga
  Okayama University, Japan

  Jeong-Ki Pack
  Chungnam National University, Korea

  Mold Zarar Mohd Jenu
  Kolej Universiti Teknologi, Malaysia

  Tzong-Lin Wu
  National Taiwan University, Taipei
 

Webmaster   Mark Tan
  A-STAR IHPC, Singapore 
  tanyc@ihpc.a-star.edu.sg

 

 

Symposium Technical Programme Committee  (TPC)

TPC Chairs   Flavio Canavero
  Politecnico di Torino, Italy

  Osamu Fujiwara
  Nagoya Institute of Technology, Japan

  Zhongxiang Shen
  Nanyang Technological University, Singapore
 

Technical Chairs
TC-1: EMC Management, Standards and Regulations   Elya B. Joffe, Israel

  Wee-Jin Koh
  DSO National Laboratory, Singapore

TC-2: EMC Measurement Techniques   Perry Wilson
  National Institute of Standards and Technology, USA

  Wei Hong
  South East University, China
 

TC-3: Lightning   Yoshihiro Baba
  Doshisha University, Japan

  Vladimir A. Rakov
  University of Florida, USA

  Farhad Rachidi
  Swiss Federal Institute of Technology - Lausanne (EPFL), Switzerland
 

TC-4: Electromagnetic Environment   Jinliang He
  Tshinghua University, China
TC-5: High Power EMC and EMC Protection, Power System EMC   Xiang Cui
  North China Electric Power University

  W. Radasky
  Metatech Co., USA
 

TC-6: System Level EMC & PCB EMC Issues   Frank Leferink
  University of Twente, Netherlands

  Wenyan Yin
  Shanghai Jiaotong University, China
 

TC-7: Transportation EMC including Automotive, Aerospace, Ship, Railway etc   Todd Hubing
  Clemson University, USA

  Martin Aidam
  DaimlerChrysler AG, Germany
 

TC-8: Antenna & Propagation Issues   Yi-Long Lu
  Nanyang Technological University, Singapore
TC-9: Electronic Packaging and Integration EMC   Joungho Kim
  KAIST (Korea Advanced Institute of Science and Technology), Korea

  Tzong-Lin Wu
  National Taiwan University, Taipei
 

TC-10: Power Integrity and Signal Integrity   James, Drewniak
  University of Missouri-Rolla, USA

  Er-Ping Li
  A*-STAR IHPC, Singapore
 

TC-11: Communication EMC   Jianguo Ma
  University of Electronic Science and Technology of China

  Franz Schlagenhaufer
  University of West Australia, West Australia
 

TC-12: Computational Electromagnetics   Jianming Jian, USA
  University of Illinois at Urbana-Champaign (UIUC), USA

  Le-wei Li
  National University of Singapore

  Christos Christopoulos
  University of Nottingham, UK
 

TC-13:  Nanotechnology for EMC including Metamaterial, Photonics, Nanotube Applications   W.J.R. Hoefer
  University of Victoria, CANADA
TC-14: Microwave Electronics and Components   Robert Weigel
  Friedrich-Alexander University, Germany
TPC Member   Sungtek Kahng
  University of Incheon, Korea

 

Topical Meeting - Integrated Circuit EMC Organising Committee

  Chair and Organizer   Sonia Ben Dhia
  INSA, France
  sonia.bendhia@insa-toulouse.fr

  Thomas Steinecke
  Infineon, Germany
  thomas.steinecke@infineon.com
 

  Co-Chairs   A. Boyer
  INSA, France

  M. Coenen
  Philips, Nedherland

  B.  Deutschmann
  Infineon, Germany

  M. F. Lafon
  Valeo, France

  Junfa Mao
  Shanghai Jiaotong University, China

  C. Marot
  EADS, France

  M. Ramdani
  ESEO, France

  B. Vrignon
  Freescale, France

  O. Wada
  Kyoto University, Japan

  S. Yuan
  Feng Chia University, Taiwan

 

 

Topical Meeting - Biomedical Electromagnetics Organising Committee

  Chair and Organizers   Michal Okoniewski
  University of Calgary, Canada
  michal@enel.ucalgary.ca

  JianQing Wang
  Nagoya Institute of Technology, Japan
  wang@nitech.ac.jp
 

  Co-Chairs   Jib Chen
  University of Houston, USA

  Elise Fear
  University of Calgary, Canada

  Tamer S. Ibrahim
  University of Oklahoma, USA

  Koichi Ito
  Chiba University, Japan

  Jeong-Ki Pack
  Chungnam National University, Korea

  Maria Stuchly
  University of Victoria, Canada

  J. Thomas Vaughan
  University of Minnesota, USA
 

 


 

  Symposium & Exhibition Secretariat

  CMA International Consultants Pte Ltd
  1 Liang Seah Street, #02-02 Liang Seah Place
  Singapore 189022
  Tel: +65-63362328  Fax: +65-63362583
  Email:   apemc@cma.sg

 

 

 

 

General Information: Background Asia-Pacific EMC Week | President's Message | Organisers | Past EMC Symposia

 

Last update: 10th April 2007 by APEMC & EMC-Zurich  webmaster