& Tutorials Program
T-AM-1: High Speed PCB Design
- 11:10am, Monday, 21 May 2012
Leferink, University of Twente, Netherlands
tutorial explains the effects encountered in electrical
interconnections as frequencies are increased. The simple, low
frequency approach based on lumped parameter inductive and capacitive
models are replaced by per unit length versions. This becomes critical
when a signal transition fits the length of an interconnecting line
(combination of risetime and propagation speed). Interconnections
become transmission lines and impedance control is necessary to reduce
reflections and assure signal integrity.
Another effect is crosstalk between “long” lines.
Using several practical demonstrations, these effects are made visible.
Measures are then explained and demonstrated that can be used to reduce
the undesired effects. One of the tricks is the partitioning of an
electrically “large” design into smaller modules
using the current boundary.
Finally, the similarity between crosstalk and field emission of
transmission line structures is explained and demonstrated, together
with the measures to reduce both effects.
||High Speed PCB Design - Part I
Frits Buesink, University of Twente, Netherlands
||High Speed PCB Design - Part II
Buesink, University of Twente, Netherlands
graduated in 1977 at the Twente University of Technology (UT),
Electrical Engineering Department, in Enschede (Netherlands) and works
at the former Hollandse Signaal Apparaten, now Thales Nederland B.V. in
Hengelo, the Netherlands.
In 1989 he became involved with EMC and has set up educational programs
for EMC awareness in the various disciplines in the company. He is a
member of the Environmental Competence Center at Thales and works as an
EMC engineering consultant for various programmes. In May 2009, he also
joined the Faculty of Telecommunications Engineering at the Twente
University as a part time researcher to coach PhD students in the EMC